Application Example: Oxide Etcher
【Issue】
In plasma-based semiconductor processes—such as etching—electrostatic chucks (ESCs) are exposed to extreme conditions. One common issue is the degradation of bonding materials that connect the base and dielectric layers of the ESC.
Standard OEM bonding materials typically begin to corrode after processing 70,000 to 100,000 wafers, leading to helium leaks, particle contamination, and other performance issues. These problems can reduced production efficiency.
【Our Solution】
We have developed a high-durability bonding material designed specifically for plasma-intensive environments.
Proven through testing, our material maintains integrity even after 250,000 wafers, showing no signs of corrosion or degradation.
This greatly extends ESC lifespan, reduces maintenance needs, and helps manufacturers achieve more stable operations with fewer interruptions.
Ultimately, our solution supports higher tool availability, lower total cost of ownership, and improved process reliability on the fab.
